助力商超、零售行业各类门店智能升级
项目背景：
1.商超作为人们最经常出现的场景，是竞争白热化却又最直观的的战场，大量的商超在竞争过程中，已经达到了营销最大化，急需解决现存的痛点和引入新的元素，以提升客户体验感，促进营业销售。
2.缺少互动营销方式，数据发展仍不健全，推广活动无人关注，设施雷同吸引力弱
方案构成：
BUDDY导览机器人
方案亮点：
1.智能推广：BUDDY通过人脸识别，识别顾客身份，记录其喜好，依靠云端大数据进行智能推荐，提升营业额。
2.智能导购：通过语音交互，了解顾客的需求，自主导航引领顾客至所需消费场景，提高客户体验感。
3.智能娱乐：BUDDY内置唱歌舞蹈，娱乐抽奖，游戏互动等功能，提升客户体验感，满足差异化的需求
4.智能巡逻：拥有复合型定位导航技术BUDDY，可以在超市自如穿梭，配合深度视觉系统，实现智能巡逻。
助力智慧医疗智能升级
项目背景：
1.现有的导诊服务大都只是停留在被动服务的层面上。就像一个问询处，被动的解答一些患者的提问，有的甚至连分诊的目的都达不到，这种导诊服务形式已远远不能满足患者就医的需求。
2.护理人员人力配备短缺是全国护理工作的一个难题，有些医院由于护士缺编，不能保证导医人员全部由护士中挑选。有些医院导医人员岗位设置少，就简单的在门诊大厅设有导医咨询台，则更难满足病人的需要。
3.现有导医人员专业知识缺乏，经验不足、整体素质不高。对咨询保健、预防、治疗和康复一体化需求难以圆满的解答。病人咨询的病后注意事项、预防等问题，在服务的效率和咨询等方面不尽人意。
4.尽管自助机和人工台全部开放但是医院等待挂号的患者人流量大。医院的导诊台、挂号窗口和门诊不仅分散难找，挂号后还增加了一道排号程序排队挂号的患者摩肩接踵，准备上楼看病的患者不得不绕道而行。
方案构成：
BUDDY导览机器人
方案亮点：
1.智能导诊：通过深度学习模块训练，BUDDY可以为患者进行准确高效的导诊服务，减轻导诊压力。
2.院内导航：领路带路，院内位置导航，语音命令自动领路到指定地点。改善就医体验，提高医疗服务质量。
3.专业问答：为患者解答专业问题，减轻护士工作量。优化患者就诊体验，准确高效的回复访客咨询，实现服务标准规范化。
助力智慧政务智能升级
项目背景：
1.政务大厅必备多名咨询服务人员，人力成本较高，咨询时简单问题重复回答，考验工作人员耐心和服务质量。此外，进一步推动政务公开、资源流动成困扰。
2.政务机构人力配备存在差异，机构人员服务水平存在差异，业务办理排队人多，党政宣传形式单一，政务政策咨询量大。
3.在线办理业务种类少；资料仍需线下递交审核；老年人无法线上办理业务。
4.群众越来越重视政务服务质量；服务质量已成为衡量政务的重要指标。
方案构成：
BUDDY导览机器人
方案亮点：
1.智能分流：智能选择辅助处理或导引至办事窗口，有效提升服务效率，减少办事人员排队等待时间。
2.智能宣传：BUDDY使用语音、视频、文字、图片等多种互动模式，进行政务政策宣传，使党政宣传深入人心。
3.智能咨询：智能身份识别，询问所需办理业务，准确高效的回复访客咨询，实现服务标准规范化。
助力展厅、博物馆等公共空间智能升级
项目背景：
1.作为历史文化的重要载体，博物馆是沟通过去、当下和未来的重要公共文化场所。而博物馆的服务受限于经费或场馆要求，仍存在一些问题。
2.安防人力投入大，展示形式缺少新意，展厅讲解员少，形象改造费用大。
3.传统讲解缺乏多模态联动，展示形式千篇一律，信息接受率低。
4.展馆行业发展迅速，社会需求快速增长，但展馆行业讲解水平服务不一，难以满足个性化观展需求，并且缺乏场景引导。
5.传统陈列被动式展示，互动率趣味性低，参展体验不佳。
方案构成：
BUDDY导览机器人
方案亮点：
1.智能识别：人脸识别进行信息收集，实现无感登记，减少排队入场的时间，提升体验感。
2.自主巡游：智能无死角安防，现场情况轻松掌握，根据需要进行巡游，执行安防巡查任务。
3.智能咨询：提供智能博物馆咨询服务，定制化展厅专用语义图谱，面对咨询对答如流。
4.导览讲解：热情主动的接待参观者，参观线路引导，定点宣讲，AI赋能打造智慧展厅，提升展厅形象。
The world’s first AR device chip release, semiconductor industry or bottoming out in the first quarter of next year, this company’s photoresistic product has been supplied to SMIC
The financial agency information was informed that the semiconductor industry has been progressing a lot recently. On November 17, Qualcomm released the world’s first AR device chip set -Snapdragon AR2GEN1. Snapdragon AR2GEN1 is the first chip solution for Qualcomm for AR devices, especially AR glasses. It is reported that compared with the first generation of Snapdragon XR2 platform, the overall AI performance of the Snapdragon AR2 platform increased by 2.5 times and the power consumption was reduced by 50%. On November 10th, at the International Integrated Circuit Exhibition and Seminar, Hangzhou Dibuchi Technology, a 5G IoT radio frequency chip developer, launched a 5G radio frequency transceiver chip -GC080X series. The company’s marketing director said that the appearance of the chip fills gaps in the field of domestic radio frequency receiving chips and has positive significance for the domestic market of 5G RF transceiver.
1. Global semiconductor industry or bottoming out in the first quarter of next year
Tianfeng Securities Research Report pointed out that the A -share semiconductor sector has been adjusted for more than one year since July 2021. It is believed that the industry has appeared in the third quarter of 2022:
1) Some design companies have begun to decline in inventory, and the net profit of the design sector fell by 61%year -on -year;
2) The capacity utilization rate of wafers has begun to decline, and the trend of foundry costs or structural price reductions;
3) The contract liabilities of some equipment companies have decreased month -on -month;
According to ICINSIGHT’s forecast, the global semiconductor industry is expected to bottom out in the first quarter of 2023. Combined with the three quarters of the A -share semiconductor report, it is determined that the performance of the A -share semiconductor industry is currently in the left part of the bottom. At the bottom of the opportunity, continue to pay attention to the release of the bottom signal of the industry, and actively deploy the next round of cycle.
2. The current international situation in the international situation is expected to accelerate the domestic market of the whole industry chain
Tianfeng Securities further stated that the development logic of the semiconductor industry has changed significantly. The global division of labor cooperation is gradually decreasing. With the increasing uncertainty of the external environment, the domestic market of the entire industry chain is expected to surpass the industrial cycle and become future domestic semiconductor The main line of industry development.
According to the policy side, according to the “Eighth Five -Year Plan” plan to the “Fourteenth Five -Year Plan” plan for my country’s national economy, they are also actively supporting the development of integrated circuits in my country, emphasizing breaking through key technologies of integrated circuits, and developing integrated circuits for the development of centralized forces in the national system. In 2021, the “Fourteenth Five -Year Plan and Outline of the 2035 Variance Target” proposed to improve the new national system under my country’s socialist conditions, fight key core technologies, and promote the optimization allocation and resource sharing of scientific research institutes, universities, and corporate scientific research forces and resource sharing Essence
At present, my country has gradually stepped out of a number of outstanding leading companies in the field of semiconductor equipment parts/equipment/materials. The products have successively passed the domestic production line such as medium/Huahong/Longxin. It is expected that the domestic market of the industrial chain will accelerate again, and relevant domestic manufacturers are expected to usher in development opportunities.
3. Related listed companies: Jingrui Electric, Crystal Technology
Jingrui Electric UV negative, wide -spectrum positive glue, and some G wire light -engraving glue have been supplied for a long time; Idomotic light -engraving glue has been available to SMIs and other enterprises in recent years; high -end KRF photoretimeter resolution has reached 0.25 -0.13 μm, passed some important customers for testing, planned to supply in 2022; the research and development of ARF lithography glue is carried out in an orderly manner. It is expected to be completed at the end of 2022 when Meishan Jingrui has a 1,200 -ton lumic glue project.
Zhongjing Technology has 42 invention patents and 64 practical new patents, covering all aspects of semiconductor silicon materials and semiconductor power chips and devices.
The world’s first AR device chip release, semiconductor industry or bottoming out in the first quarter of next year, this company’s photoresistic product has been supplied to SMIC
The financial agency information was informed that the semiconductor industry has been progressing a lot recently. On November 17, Qualcomm released the world’s first AR device chip set -Snapdragon AR2GEN1. Snapdragon AR2GEN1 is the first chip solution for Qualcomm for AR devices, especially AR glasses. It is reported that compared with the first generation of Snapdragon XR2 platform, the overall AI performance of the Snapdragon AR2 platform increased by 2.5 times and the power consumption was reduced by 50%. On November 10th, at the International Integrated Circuit Exhibition and Seminar, Hangzhou Dibuchi Technology, a 5G IoT radio frequency chip developer, launched a 5G radio frequency transceiver chip -GC080X series. The company’s marketing director said that the appearance of the chip fills gaps in the field of domestic radio frequency receiving chips and has positive significance for the domestic market of 5G RF transceiver.
1. Global semiconductor industry or bottoming out in the first quarter of next year
Tianfeng Securities Research Report pointed out that the A -share semiconductor sector has been adjusted for more than one year since July 2021. It is believed that the industry has appeared in the third quarter of 2022:
1) Some design companies have begun to decline in inventory, and the net profit of the design sector fell by 61%year -on -year;
2) The capacity utilization rate of wafers has begun to decline, and the trend of foundry costs or structural price reductions;
3) The contract liabilities of some equipment companies have decreased month -on -month;
According to ICINSIGHT’s forecast, the global semiconductor industry is expected to bottom out in the first quarter of 2023. Combined with the three quarters of the A -share semiconductor report, it is determined that the performance of the A -share semiconductor industry is currently in the left part of the bottom. At the bottom of the opportunity, continue to pay attention to the release of the bottom signal of the industry, and actively deploy the next round of cycle.
2. The current international situation in the international situation is expected to accelerate the domestic market of the whole industry chain
Tianfeng Securities further stated that the development logic of the semiconductor industry has changed significantly. The global division of labor cooperation is gradually decreasing. With the increasing uncertainty of the external environment, the domestic market of the entire industry chain is expected to surpass the industrial cycle and become future domestic semiconductor The main line of industry development.
According to the policy side, according to the “Eighth Five -Year Plan” plan to the “Fourteenth Five -Year Plan” plan for my country’s national economy, they are also actively supporting the development of integrated circuits in my country, emphasizing breaking through key technologies of integrated circuits, and developing integrated circuits for the development of centralized forces in the national system. In 2021, the “Fourteenth Five -Year Plan and Outline of the 2035 Variance Target” proposed to improve the new national system under my country’s socialist conditions, fight key core technologies, and promote the optimization allocation and resource sharing of scientific research institutes, universities, and corporate scientific research forces and resource sharing Essence
At present, my country has gradually stepped out of a number of outstanding leading companies in the field of semiconductor equipment parts/equipment/materials. The products have successively passed the domestic production line such as medium/Huahong/Longxin. It is expected that the domestic market of the industrial chain will accelerate again, and relevant domestic manufacturers are expected to usher in development opportunities.
3. Related listed companies: Jingrui Electric, Crystal Technology
Jingrui Electric UV negative, wide -spectrum positive glue, and some G wire light -engraving glue have been supplied for a long time; Idomotic light -engraving glue has been available to SMIs and other enterprises in recent years; high -end KRF photoretimeter resolution has reached 0.25 -0.13 μm, passed some important customers for testing, planned to supply in 2022; the research and development of ARF lithography glue is carried out in an orderly manner. It is expected to be completed at the end of 2022 when Meishan Jingrui has a 1,200 -ton lumic glue project.
Zhongjing Technology has 42 invention patents and 64 practical new patents, covering all aspects of semiconductor silicon materials and semiconductor power chips and devices.
